Products
Product Introduction
LED
Industrial Control
We invest a lot of resources in technology research and development, especially in medical devices, automotive electronics, testing and control systems, instrumentation, etc., where the accuracy and stability of products are extremely high. With its advanced automated production lines and precision inspection equipment, we are able to ensure the high-quality output of our products and meet the needs of the industrial control industry for highly reliable components.
Computer
We not only specialize in the design and manufacture of printed circuit boards (PCBS), but also provide comprehensive solutions in a number of related fields, including but not limited to computer motherboards, laptops, servers and other computer-related accessories. We continue to develop technologies and innovate products, especially in high-speed signal processing, thermal management and EMI/RFI shielding. These technological advances directly improve the performance and stability of the computer motherboard and other key components, helping to improve the overall operating efficiency of the system.
Server
我们擅长制造高精度、高密度的双面及多层PCB，这是服务器主板及其他关键组件的核心。这些PCB在服务器中起着至关重要的作用，因为它们承载着大量的电子元件，如处理器、内存模块、电源管理单元等。我们的PCB能够确保服务器内部各个组件之间信号传输的准确性和稳定性，进而保障服务器的整体性能。
Communication
We specialize in the manufacture of high-precision, high-density double-sided and multi-layer printed circuit board PCBS, which are an integral part of communication equipment. These PCBS carry a large number of electronic components, such as processors, RF modules, antenna interfaces, etc., which are critical to the performance of communication devices. Our PCBS ensure the accuracy and stability of signal transmission between the various components within the communication equipment, thus guaranteeing the overall performance of the communication equipment.
Automotive
We specialize in manufacturing high-precision, high-density double-sided and multilayer printed circuit PCBS, which are essential for automotive electronic systems. These PCBS carry various electronic components in the car, such as sensors, controllers, in-car entertainment systems, etc. Our PCBS ensure the accuracy and stability of signal transmission between the various components within the automotive electronic system, thereby guaranteeing the safety and driving experience of the vehicle.
Medical
We are able to provide customized PCB design and manufacturing services according to the specific needs of our customers. There are many kinds of medical equipment, including diagnostic equipment, monitoring equipment, treatment equipment, etc., and each equipment has different requirements for PCB. Our team of professionals can understand these needs and provide tailored solutions to ensure stable operation of medical devices in a variety of complex environments.
Other
We continue to develop technology, especially in high-speed signal processing, RF signal processing, thermal design, electromagnetic compatibility (EMC) and other areas have made significant progress. Advances in these technologies are critical to a number of high-tech areas, including mobile phones, wearables, iot devices, and other electronics.
Product Application
| 展品编号(Exhibit number): | JSY-007 |
| 产品应用(Exhibit number): | LED lamp panel |
| 产品结构(Product mix): | 4 layers 1 order - point spacing P1.25 |
| 产品厚度(Product thickness): | 1.6mm |
| 线宽线距(Line width Line distance): | 3.5/3.5mi |
| 最小孔径(Min Hole Diameter): | Laser perforation 0.1mm |
| 表面处理(Surface treatment): | oxidation resistance |
| 工艺特点(Technological characteristics): | The number of lamp PAD is 129600; The distance between cable and PAD is 3.5mil |
| 钻孔结构(Borehole structure): | 1-2/2-3/3-4 floor |
Serial number: JSY-007
| 展品编号(Exhibit number): | JSY-010 |
| 产品应用(Exhibit number): | graphics card |
| 产品结构(Product mix): | 4 layers through holes |
| 产品厚度(Product thickness): | 1.2mm |
| 线宽线距(Line width Line distance): | 4/4mil |
| 最小孔径(Min Hole Diameter): | Through hole 0.2mm |
| 表面处理(Surface treatment): | Antioxidant + gold-plated finger 3U |
| 工艺特点(Technological characteristics): | Gold-plated finger |
| 钻孔结构(Borehole structure): | 1-4 floor |
Number: JSY-010
| 展品编号(Exhibit number): | JSY-013 |
| 产品应用(Exhibit number): | graphics card |
| 产品结构(Product mix): | 6 layers through holes |
| 产品厚度(Product thickness): | 1.6mm |
| 线宽线距(Line width Line distance): | 3.5/3.5mil |
| 最小孔径(Min Hole Diameter): | Through hole 0.2mm |
| 表面处理(Surface treatment): | Antioxidant + gold-plated finger 10U |
| 工艺特点(Technological characteristics): | Gold plated finger 10U |
| 钻孔结构(Borehole structure): | 1-6 floor |
Number: JSY-013
| 展品编号(Exhibit number): | JSY-007 |
| 产品应用(Exhibit number): | mainboard |
| 产品结构(Product mix): | 4 layers through holes |
| 产品厚度(Product thickness): | 1.2mm |
| 线宽线距(Line width Line distance): | 4/4mil |
| 最小孔径(Min Hole Diameter): | Through hole 0.2mm |
| 表面处理(Surface treatment): | Antioxidant + gold-plated finger 3U |
| 工艺特点(Technological characteristics): | Gold-plated finger |
| 钻孔结构(Borehole structure): | 1-4 floor |
Serial number: JSY-007
| 展品编号(Exhibit number): | JSY-014 |
| 产品应用(Exhibit number): | mainboard |
| 产品结构(Product mix): | 12 layers through holes |
| 产品厚度(Product thickness): | 1.6mm |
| 线宽线距(Line width Line distance): | 3/3mil |
| 最小孔径(Min Hole Diameter): | Through hole 0.2mm |
| 表面处理(Surface treatment): | Gold Plating |
| 工艺特点(Technological characteristics): | BGA size 0.15*0.25mm double cpu |
| 钻孔结构(Borehole structure): | 1-12 floor |
Number: JSY-014
| 展品编号(Exhibit number): | JSY-020 |
| 产品应用(Exhibit number): | Server |
| 产品结构(Product mix): | 14层通孔 |
| 产品厚度(Product thickness): | 2.0mm |
| 线宽线距(Line width Line distance): | 4/4mil |
| 最小孔径(Min Hole Diameter): | Through hole 0.2mm |
| 表面处理(Surface treatment): | oxidation resistance |
| 工艺特点(Technological characteristics): | 高速板、3个背钻、 10:1厚径比 |
| 钻孔结构(Borehole structure): | 1-14层 |
编号：JSY-020
| 展品编号(Exhibit number): | JSY-021 |
| 产品应用(Exhibit number): | Server |
| 产品结构(Product mix): | 12 layers through holes |
| 产品厚度(Product thickness): | 2.3mm |
| 线宽线距(Line width Line distance): | 4/4mil |
| 最小孔径(Min Hole Diameter): | 通孔0.25mm |
| 表面处理(Surface treatment): | oxidation resistance |
| 工艺特点(Technological characteristics): | 9:1厚径比 |
| 钻孔结构(Borehole structure): | 1-12 floor |
编号：JSY-018
| 展品编号(Exhibit number): | JSY-007 |
| 产品应用(Exhibit number): | interphone |
| 产品结构(Product mix): | 8 floors -2 floors |
| 产品厚度(Product thickness): | 1.6mm |
| 线宽线距(Line width Line distance): | 4/4mil， Laser perforation 0.1mm |
| 最小孔径(Min Hole Diameter): | Through hole 0.2mm |
| 表面处理(Surface treatment): | Gold Plating |
| 工艺特点(Technological characteristics): | 5 BGA, pressed 3 times; Two fillings, two lasers; Through hole resin jack |
| 钻孔结构(Borehole structure): | 1-2/2-3/1-3/3-6/ 6-7/7-8/6-8/1-8 floor |
Serial number: JSY-007
| 展品编号(Exhibit number): | JSY-011 |
| 产品应用(Exhibit number): | Headphone board |
| 产品结构(Product mix): | 6 floors, 1 level |
| 产品厚度(Product thickness): | 0.8mm |
| 线宽线距(Line width Line distance): | 4/4mil |
| 最小孔径(Min Hole Diameter): | Through hole 0.15mm; Laser perforation 0.1mm |
| 表面处理(Surface treatment): | Gold Plating |
| 工艺特点(Technological characteristics): | Metal edge |
| 钻孔结构(Borehole structure): | 1-2/2-5/5-6层 |
编号：JSY-011
| 展品编号(Exhibit number): | JSY-018 |
| 产品应用(Exhibit number): | 汽车板 |
| 产品结构(Product mix): | 双面 |
| 产品厚度(Product thickness): | 1.0mm |
| 线宽线距(Line width Line distance): | 1.0/1.0mm |
| 最小孔径(Min Hole Diameter): | 通孔0.3mm |
| 表面处理(Surface treatment): | Gold Plating |
| 工艺特点(Technological characteristics): | CTI≥600，1.5/1.5OZ |
| 钻孔结构(Borehole structure): | 1-2层 |
编号：JSY-018
| 展品编号(Exhibit number): | JSY-019 |
| 产品应用(Exhibit number): | 汽车板 |
| 产品结构(Product mix): | 双面 |
| 产品厚度(Product thickness): | 1.6mm |
| 线宽线距(Line width Line distance): | 0.2/0.2mm |
| 最小孔径(Min Hole Diameter): | 通孔0.3mm |
| 表面处理(Surface treatment): | 沉金1.5U |
| 工艺特点(Technological characteristics): | CTI≥600，1.5/1.5OZ |
| 钻孔结构(Borehole structure): | 1-2层 |
编号：JSY-019
| 展品编号(Exhibit number): | JSY-002 |
| 产品应用(Exhibit number): | Android motherboard |
| 产品结构(Product mix): | 8 floors -2 floors |
| 产品厚度(Product thickness): | 1.6mm |
| 线宽线距(Line width Line distance): | 3.5/3mil |
| 最小孔径(Min Hole Diameter): | Through hole 0.25mm; Laser perforation 0.1mm |
| 表面处理(Surface treatment): | Gold Plating |
| 工艺特点(Technological characteristics): | Five BGA, pressed three times, Two fillings, two lasers |
| 钻孔结构(Borehole structure): | 1-2/2-3/1-3/3-6/ 6-7/7-8/6-8/1-8 floor |
Serial number：JSY-002
| 展品编号(Exhibit number): | JSY-007 |
| 产品应用(Exhibit number): | interphone |
| 产品结构(Product mix): | 8 floors -2 floors |
| 产品厚度(Product thickness): | 1.6mm |
| 线宽线距(Line width Line distance): | 4/4mil， Laser perforation 0.1mm |
| 最小孔径(Min Hole Diameter): | Through hole 0.2mm |
| 表面处理(Surface treatment): | Gold Plating |
| 工艺特点(Technological characteristics): | 5 BGA, pressed 3 times; Two fillings, two lasers; Through hole resin jack |
| 钻孔结构(Borehole structure): | 1-2/2-3/1-3/3-6/ 6-7/7-8/6-8/1-8 floor |
Serial number: JSY-006
Quality Control
Production Phase
In today's fast-paced business environment, Jinshiyu Electronics Co., Ltd. knows that time is money. Therefore, the company is always committed to providing customers with punctual and flexible delivery services and professional and rapid response capabilities.
